Open-Top Electronics Enclosure

A 3D-printable rectangular electronics enclosure box without a lid, outer dimensions 115 mm length (X-axis), 80 mm width (Y-axis), and 36 mm height (Z-axis), with a uniform wall thickness of 2.5 mm and a 2.5 mm thick flat bottom floor. Add 3 mm outer corner fillets on the vertical edges. In each of the four inner corners, add a vertical cylindrical mounting boss 6 mm in diameter, extending from the floor up to 34 mm height, each with a 2.5 mm through-hole for M3 screws. On the inner floor, add three sets of cylindrical PCB standoffs (4 mm outer diameter, 1.8 mm inner pilot hole, 4 mm height): Set 1 (ESP32-C3 cradle) near the front-left wall with two parallel 1.5 mm wide retention rails spaced 18.2 mm apart to hold an 18 mm x 22.5 mm microcontroller board; Set 2 (JSN-SR04T ultrasonic module) near the back-right area with four standoffs arranged in a 37 mm x 22 mm rectangle; Set 3 (LR7843 MOSFET module) near the front-right area with four standoffs arranged in a 28 mm x 12 mm rectangle. Cut four openings in the walls: (1) on the left wall (X=0), a rounded rectangular cutout 9.5 mm wide by 4 mm high centered at Z=8 mm for a USB-C port; (2) on the right wall (X=115), a 6.5 mm circular hole at Y=60 mm, Z=12 mm for the ultrasonic sensor cable; (3) on the right wall (X=115), an 11.5 mm circular hole at Y=35 mm, Z=14 mm for a panel-mount DC barrel jack; (4) on the right wall (X=115), a 6 mm circular hole at Y=15 mm, Z=12 mm for the water pump power cable. Add two small U-shaped cable tie loops (4 mm inner width, 2 mm thick) on the inner floor 10 mm away from the right wall cutouts for strain relief. Clean manifold geometry optimized for FDM 3D printing.

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