Electronics Enclosure Box

A 3D-printable rectangular electronics enclosure box without a lid, outer dimensions 115 mm length (X-axis from 0 to 115), 80 mm width (Y-axis from 0 to 80), and 36 mm height (Z-axis from 0 to 36), with a uniform wall thickness of 2.5 mm and a 2.5 mm thick flat bottom floor. Add 3 mm outer corner fillets on the four vertical edges. In each of the four inner corners at coordinates (5.5, 5.5), (109.5, 5.5), (5.5, 74.5), and (109.5, 74.5), add a vertical cylindrical mounting boss 6 mm in diameter extending from the floor up to Z=34 mm, each with a 2.5 mm diameter pilot hole for M3 lid screws. On the inner floor (starting at Z=2.5 mm), add 10 cylindrical PCB screw standoffs, each 4.5 mm outer diameter, 1.7 mm inner pilot hole for M2 screws, and 4 mm tall (reaching Z=6.5 mm), placed at these exact (X, Y) coordinates: (1) two standoffs at (14, 29.5) and (14, 50.5) to clamp the side edges of an 18 mm wide ESP32-C3 board, plus a small 2 mm tall backstop block at (26.5, 40) to prevent the board from sliding backward when plugging in a cable; (2) four standoffs at (52, 46), (88, 46), (52, 69.5), and (88, 69.5) forming a 36 mm x 23.5 mm rectangle for a JSN-SR04T ultrasonic module; (3) four standoffs at (55, 14), (83.5, 14), (55, 25), and (83.5, 25) forming a 28.5 mm x 11 mm rectangle for an LR7843 MOSFET module. Cut four wall openings: (1) on the left wall (X=0), centered at Y=40 mm, a rounded rectangular cutout 9.5 mm wide by 5 mm high with its bottom edge at Z=6.5 mm for a USB-C plug; (2) on the right wall (X=115), a 6.5 mm circular hole at Y=60 mm, Z=14 mm for the ultrasonic sensor cable; (3) on the right wall (X=115), a 12 mm wide by 10 mm high rectangular cutout centered at Y=38 mm, Z=14 mm for a DC barrel jack connector; (4) on the right wall (X=115), a 6 mm circular hole at Y=16 mm, Z=14 mm for the water pump cable. Clean, watertight manifold geometry optimized for FDM 3D printing without supports.

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