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Interactive 3D model of Galaxy Z Flip5 Upper Half Assembly

Enclosures and housings

Galaxy Z Flip5 Upper Half Assembly

1 views
Bounding box
106.9 × 85.1 × 8.5 mm
Engine
3D Printing B-rep
Parameters
21
Published
November 13, 2026

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The prompt

Make it this as possible remove the battery and just the cover screen and mothers with thin walls and vc add thisCheck online size of the parts of the z flip 5 i just need the cover screen no inter screen to make it smaller and tiny

Parameters

NameValueRange
Phone width71.9 mm50 – 100
Phone length85.1 mm60 – 120
Chassis height7 mm4 – 12
Chassis wall thickness0.8 mm0.6 – 2
Rear cover thickness0.7 mm0.4 – 1.5
Cover screen length66 mm40 – 90
Cover screen width52 mm35 – 70
Cover screen thickness0.8 mm0.4 – 1.5
Motherboard length55 mm30 – 80
Motherboard width40 mm25 – 60
Motherboard thickness1 mm0.6 – 2
Daughterboard length25 mm15 – 40
Daughterboard width30 mm20 – 50
Daughterboard thickness0.8 mm0.4 – 1.5
Vapor chamber length45 mm25 – 70
Vapor chamber width35 mm20 – 55
Vapor chamber thickness0.4 mm0.2 – 1
Screen distance from top edge6 mm2 – 20
Motherboard shift toward hinge10 mm0 – 30
Motherboard X center offset-15 mm-25 – 25
Daughterboard X center offset19.5 mm0 – 35

Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.

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Galaxy Z Flip5 Upper Half Assembly - Free CAD Model (STEP, STL) | TextoCAD