Brackets and mounts
XIAO Dual-Chamber Enclosure with Sliding Lid
- Bounding box
- 68.0 × 40.0 × 26.0 mm
- Engine
- Precision B-rep
- Parameters
- 16
- Published
- August 21, 2026
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The prompt
Design a 3D-printable dual-chamber enclosure for a Seeed Studio XIAO ESP32S3 Sense with OV5640 camera (with heatsink) and a 2×AA SMT battery holder. Key Specifications & Features: Dimensions: ~36 mm (W) × 64 mm (L) × 24 mm (H), 2.0 mm wall thickness. Layout: Stacked dual-chamber separated by a 1.6 mm bulkhead with wire pass-through. Upper Chamber: Internal cradle for XIAO board (21×17.5 mm + 0.3 mm clearance), front cutout for 9.5 mm lens barrel, passive convective vent slots for the heatsink, chamfered USB-C port (9.5×4.5 mm), and accessible microSD slot. Lower Chamber: Housing for 2×AA SMT holder with solder pad clearance. Battery Access: Tool-free sliding lid with guide rails (0.25 mm clearance), retention detent bump, and external grip ridges. Manufacturing: FDM-optimized for PETG/ABS with 0.2 mm layer height, minimal overhangs, and STEP/STL export."
Parameters
| Name | Value | Range |
|---|---|---|
| Length | 64 mm | 40 – 100 |
| Width | 36 mm | 25 – 60 |
| Height | 24 mm | 20 – 40 |
| Wall Thickness | 2 mm | 1 – 3 |
| Bulkhead Thickness | 1.6 mm | 1 – 3 |
| Lower Chamber Height | 10 mm | 6 – 16 |
| Lens Cutout Diameter | 9.5 mm | 5 – 15 |
| USB-C Opening Width | 9.5 mm | 6 – 15 |
| USB-C Opening Height | 4.5 mm | 3 – 8 |
| MicroSD Slot Width | 12 mm | 8 – 20 |
| MicroSD Slot Height | 1.2 mm | 0.8 – 3 |
| Vent Slot Length | 10 mm | 4 – 20 |
| Vent Slot Width | 2 mm | 1 – 4 |
| Vent Slot Count | 3 mm | 1 – 8 |
| Wire Pass-Through Diameter | 3 mm | 1 – 6 |
| Lid Thickness | 3 mm | 1 – 6 |
Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.
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