SFF PC Case for BC-250

Create a compact vertical SFF PC case specifically for the **AMD BC-250 board**. ### Hardware BC-250 board envelope: approximately **341.6 × 144.3 × 32.1 mm**. Mount the board vertically along its 341.6 mm axis. Treat these dimensions as the PCB/component envelope, not the final case dimensions. Add clearance for connectors, cables and cooling. Use a **MetalFish 600W Flex-ATX PSU**, mounted toward the rear/backplate side. Keep the PSU separate from the main cooling airflow. ### Airflow Design a controlled **front-to-left-side airflow tunnel**: **FRONT INTAKE → DUCT → BC-250 HEATSINK → LEFT EXHAUST** Use a large front axial fan with a removable dust filter. Create a smooth internal duct so most airflow is directed through the main heatsink instead of dispersing inside the case. Target approximately **80% primary airflow through the cooler and 20% secondary airflow around the board/VRM**. The left side must provide a large, low-restriction exhaust area. Keep PSU airflow independent from the BC-250 cooling path. ### Structure Create a rigid internal frame for the BC-250, PSU, fan and ducts. Make mounting points, clearances, fan size, PSU position and duct dimensions parametric. Design the case as modular FDM-printable parts with screw mounts and heat-set insert locations. ### Exterior Surround the engineered internal chassis with an **organic generative/Voronoi skeletal shell**. Do not simply texture a box. Use flowing structural ribs, larger open cells in airflow areas and thicker ribs around corners and mounting points. The front should visually read as the intake and the left side as the exhaust. Design order: **BC-250 → clearances → cooling → airflow ducts → PSU → structural frame → organic shell.** Prioritize hardware fit, airflow, structural integrity and printability over aesthetics.

Parameters

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