Brackets and mounts
Fault-Tolerant Compute Enclosure (Exploded Parts)
- Bounding box
- 565.0 × 70.0 × 25.0 mm
- Engine
- Precision B-rep
- Parameters
- 41
- Published
- September 16, 2026
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The prompt
"Technical product render of a compact embedded electronics enclosure for an adaptive fault-tolerant computing board. Rectangular matte gray ABS/aluminum case, approximately 100mm x 70mm x 25mm, with ventilation slots on the sides. Fusion 360 CAD render style, isometric 3/4 view, studio lighting, neutral background. Semi-transparent or exploded-view overlay showing the internal PCB with two symmetric, physically separated compute modules (labeled 'Primary MCU/FPGA' and 'Redundant Copy'), connected to a central comparator/voter chip, with a power regulation strip along one edge. Include a small JTAG/programming header on one side edge and mounting standoff holes at the four corners. Engineering diagram aesthetic, light blue and teal color accents on the PCB traces, clean technical documentation style." Fusion 360 steps to build the actual 3D model (enclosure + board): Start with your existing 2D sketch (the PCB floorplan you already made) — extrude the board outline by 1.6mm (standard PCB thickness) to create the PCB body Create the enclosure: new sketch on a plane above the PCB, draw a rectangle ~10mm larger on each side than your board outline, extrude upward ~20-25mm to form the case walls (use Shell command to hollow it out, 2mm wall thickness) Add standoffs: at the four corners, sketch small circles (3mm dia) and extrude them up from the case floor to hold the PCB with screws Add ventilation slots: sketch thin rectangles on the side walls, use Extrude → Cut to punch them through Add a lid: mirror/offset the base shape, extrude thin (2mm), use the Combine tool set to "New Body" so it's a separate part you can show open or closed Component blocks on the PCB (optional but impressive for a viva): extrude small rectangular blocks at the primary/redundant/voter locations from your 2D sketch to represent chip packages — gives a populated-board look without needing exact component footprints Export: save as .f3d, then export STL of the enclosure (for the "STL export" requirement) and a rendered screenshot/PDF of the assembly for your design brief
Parameters
| Name | Value | Range |
|---|---|---|
| Case Length | 100 mm | 40 – 300 |
| Case Width | 70 mm | 30 – 250 |
| Case Height | 25 mm | 10 – 120 |
| Wall Thickness | 2 mm | 1 – 6 |
| Corner Radius | 2 mm | 0 – 10 |
| Vent Slot Length | 20 mm | 5 – 60 |
| Vent Slot Height | 3 mm | 1 – 10 |
| Vent Rows per Side | 3 rows | 1 – 8 |
| Vent Slots per Row | 4 slots | 1 – 10 |
| Standoff Boss Dia | 6 mm | 3 – 15 |
| Standoff Height | 5 mm | 1 – 20 |
| Standoff Screw Hole Dia | 3 mm | 1 – 8 |
| Lid Thickness | 2 mm | 0.8 – 8 |
| Lid Locating Lip | 1 mm | 0.2 – 6 |
| Lid Side Clearance | 1 mm | 0.2 – 5 |
| Lid Vent Slot Length | 50 mm | 10 – 200 |
| Lid Vent Slot Width | 3 mm | 1 – 12 |
| Lid Vent Count | 3 slots | 1 – 8 |
| PCB Length | 80 mm | 30 – 250 |
| PCB Width | 50 mm | 20 – 200 |
| PCB Thickness | 1.6 mm | 0.8 – 4 |
| PCB Mounting Hole Dia | 3 mm | 1 – 8 |
| Hole Inset From Edge | 5 mm | 1 – 20 |
| Trace Width | 0.5 mm | 0.15 – 3 |
| Trace Relief Height | 0.15 mm | 0.05 – 1 |
| Trace Count | 5 traces | 0 – 15 |
| Compute Module Size | 25 mm | 8 – 60 |
| Compute Module Height | 3 mm | 0.8 – 15 |
| Module Die Size | 12 mm | 3 – 40 |
| Module Die Height | 0.5 mm | 0.1 – 5 |
| Voter Chip Size | 10 mm | 4 – 30 |
| Voter Chip Height | 2 mm | 0.5 – 10 |
| Voter Die Size | 5 mm | 1 – 20 |
| Voter Die Height | 0.4 mm | 0.1 – 3 |
| Power Strip Length | 40 mm | 10 – 120 |
| Power Strip Width | 8 mm | 3 – 30 |
| Power Strip Height | 3 mm | 0.8 – 12 |
| JTAG Header Length | 10 mm | 4 – 30 |
| JTAG Header Width | 5 mm | 2 – 20 |
| JTAG Header Height | 5 mm | 1 – 20 |
| Exploded Layout Gap | 25 mm | 5 – 100 |
Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.
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