EconoDUAL 3 SiC Half-Bridge Module (Simplified Layout)

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Bounding box: 152.4 × 122.9 × 23.0 mm
Engine: Precision B-rep
Parameters: 26
Published: October 18, 2026

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請建立一個Infineon Econodual 3含內外部整理模型，整體結構含底板，外殼，兩塊AMB基板，有個4 SiCMOS併的半橋拓墣，晶片上有鋁線連接，每個晶片配上一個Rg，建立最低換留迴路寄生電感的layout設計。

Parameters

Name	Value	Range
Module length	152.4 mm	100 – 200
Module width	119.4 mm	80 – 160
Baseplate thickness	3 mm	1 – 10
Baseplate corner fillet	2 mm	0 – 5
Housing height	12 mm	5 – 30
Housing wall thickness	3 mm	1 – 8
Terminal length	15 mm	5 – 30
Terminal width	10 mm	3 – 20
Terminal height	8 mm	2 – 20
AMB substrate length	60 mm	30 – 80
AMB substrate width	45 mm	25 – 80
AMB substrate thickness	0.8 mm	0.2 – 3
Copper layer thickness	0.3 mm	0.05 – 1
Substrate gap	8 mm	2 – 20
AC bridge width	20 mm	5 – 40
AC bridge thickness	0.5 mm	0.1 – 2
SiC dies per switch	4 pcs	2 – 6
Die size	6 mm	2 – 12
Die thickness	0.2 mm	0.05 – 1
Die pitch X	14 mm	5 – 30
Die pitch Y	16 mm	5 – 20
Rg length	4 mm	1 – 10
Rg width	2 mm	0.5 – 6
Rg height	1 mm	0.2 – 4
Al bond wire diameter	0.3 mm	0.1 – 1.5
Bond wire loop height	1.2 mm	0.3 – 5

Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.

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