Everything else
EconoDUAL 3 Module Housing with AMB Substrates, SiC Dies & Bond Wires
- Bounding box
- 152.0 × 62.0 × 17.0 mm
- Engine
- Precision B-rep
- Parameters
- 18
- Published
- October 18, 2026
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Free to download and use. See the terms.
The prompt
請建立Infineon ECONODUAL 3模組的外殼，含上蓋，底板，兩塊AMB雙面銅(0.3mm厚)，以每臂4顆SicMOS晶片 (5mmx5mm)構成一半橋拓墣，加上金屬導線(15mil每條)
Parameters
| Name | Value | Range |
|---|---|---|
| Module Length | 152 mm | 80 – 250 |
| Module Width | 62 mm | 30 – 120 |
| Baseplate Thickness | 3 mm | 1 – 8 |
| Wall Thickness | 3 mm | 1.5 – 8 |
| Wall Height | 12 mm | 5 – 30 |
| Lid Thickness | 2 mm | 0.5 – 6 |
| Substrate Length | 60 mm | 20 – 120 |
| Substrate Width | 45 mm | 15 – 100 |
| Ceramic (Si3N4) Thickness | 0.32 mm | 0.1 – 1.5 |
| AMB Copper Thickness (each side) | 0.3 mm | 0.1 – 1 |
| Gap Between Substrates | 6 mm | 1 – 30 |
| SiC MOSFET Die Size | 5 mm | 1 – 15 |
| Die Thickness | 0.15 mm | 0.05 – 1 |
| Dies per Arm | 4 pcs | 1 – 8 |
| Bond Wire Diameter (15 mil) | 0.38 mm | 0.1 – 1.5 |
| Bond Wires per Die | 3 pcs | 1 – 8 |
| Bond Wire Loop Height | 1.2 mm | 0.3 – 5 |
| Bond Wire Span | 6 mm | 2 – 20 |
Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.
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