ECONODUAL 3 Half-Bridge Module Assembly

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Bounding box: 122.0 × 62.0 × 17.0 mm
Engine: Precision B-rep
Parameters: 18
Published: October 18, 2026

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請建立ECONODUAL 3模組的外殼，含上蓋，底板，兩塊AMB雙面銅(0.3mm厚)，以每臂4顆SicMOS晶片 (5mmx5mm)構成一半橋拓墣，加上金屬導線(15mil每條)

Parameters

Name	Value	Range
Housing Length	122 mm	100 – 160
Housing Width	62 mm	60 – 80
Baseplate Thickness	3 mm	2 – 5
Top Cover Thickness	2 mm	1 – 4
Side Wall Thickness	2 mm	1 – 3
Side Wall Height	12 mm	8 – 20
AMB Substrate Length	40 mm	25 – 60
AMB Substrate Width	22 mm	15 – 28
AMB Cu Thickness	0.3 mm	0.2 – 0.5
Substrate Spacing	5 mm	3 – 8
SiC Chip Size	5 mm	3 – 8
SiC Chip Thickness	0.3 mm	0.1 – 0.5
Chips per Arm	4 mm	1 – 8
Chip Pitch X	7 mm	5 – 12
Chip Pitch Y	7 mm	5 – 12
Bond Wire Diameter	0.38 mm	0.2 – 0.8
Bond Wire Loop Height	2 mm	0.5 – 6
Wires per Chip	2 mm	1 – 4

Every value above is a live dimension. Open a model like this in the editor and each one becomes a slider you can drag before exporting.

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